High temperature diffusion furnace

A diffusion furnace is one of the most important pieces of equipment in the semiconductor manufacturing process. Its main purpose is to dope the silicon wafer under high temperature conditions so that the dopant atoms can diffuse in the silicon wafer to achieve the purpose of doping.

Through process control, substances with different characteristics are diffused from the surface of the silicon wafer to a specified depth and concentration by means of heat treatment, thereby changing and controlling the type, concentration, and distribution of impurities in the semiconductor so as to establish regions with different electrical characteristics. The machine used for high-temperature diffusion doping is called a "high temperature diffusion furnace".

Automatic gluing / developing machine

The gluing machine is mainly used for photoresist coating in the semiconductor yellow light process. Spin coating is the most widely used method for applying photoresist. The precise and quantitative photoresist is coated on the center of the wafer through the equipment, and the photoresist is evenly coated by setting the rotation speed and time control at different stages of the process. on the wafer surface. The developing machine is mainly used for the developing process in the semiconductor yellow light process.

After the wafer is exposed to the developer solution, different photoresists in the photosensitive and non-photosensitive areas will be dissolved in the developer solution. The pattern defined in the photoresist layer is revealed through development.

Fully automatic one-way exposure machine

The exposure machine is the key image pattern transfer equipment for manufacturing semiconductor silicon wafers. During the exposure production process, the exposure machine plays the role of transferring the pattern designed by the process to the silicon wafer.

The main principle of the exposure machine is to use ultraviolet light to pass through the photomask, negative film, and other pattern templates and use it with a developer to remove the photoresist on the surface of the silicon wafer to form the pattern required by the product. The automatic exposure machine does not require the operator to perform pattern alignment exposure; the parameter conditions are set in advance; the operator places the material, selects the program, and executes it, automatic wafer input and output; automatic alignment exposure; and the machine is operated 24 hours a day The machine runs automatically for production, with high reliability and increased production capacity. This machine is for single-side exposure.

Fully automatic two-way exposure machine

The exposure machine is the key image pattern transfer equipment for manufacturing semiconductor silicon wafers. During the exposure production process, the exposure machine plays the role of transferring the pattern designed by the process to the silicon wafer.

The main principle of the exposure machine is to use ultraviolet light to pass through the photomask, negative film, and other pattern templates and use it with a developer to remove the photoresist on the surface of the silicon wafer to form the pattern required by the product. The automatic exposure machine does not require the operator to perform pattern alignment exposure; the parameter conditions are set in advance; the operator places the material, selects the program, and executes it, automatic wafer input and output; automatic alignment exposure; and the machine is operated 24 hours a day The machine runs automatically for production, with high reliability and increased production capacity. This machine is for single-side exposure.

Chemical station equipment

The wet process is mainly used in the surface treatment, stripping, cleaning and etching of single or large quantities of wafers. The etchant and process used, select the corresponding tank material and functionality, and consider the uniformity and etching rate of the etching process, the flexibility of the wet process in the process steps, and the ability to improve the quality, especially suitable for wet silicon wafers. operating on the complexities of a traditional process architecture. The program processing of almost every process is the most important step in the wet process, which can be said to determine the quality of the wet process. Through design configuration and matching, it provides the best process equipment with safety, stability, high uniformity, and high output.

Fully automatic one-way and two-way point measuring machine

The wafer probe platform is a detection platform for semiconductor component electrical measurement between the wafer and the measuring instrument. The component measurement signal is input and output through the detection platform, and the probe is accurately pointed to the target object on the component. , and test the die on the wafer one by one, use the probe station with fully automatic probe structure, the arm automatically takes the wafer to the pre-aligner for leveling and spot measurement position testing, and the full-circle chuck plate can provide Stable and fast test environment, set the best spot test speed and needle mark for different applications. Provide the best testing equipment with stability, high quality and high output.

Fully automatic double spindle cutting machine

The new dual-spindle dicing machine is equipped with the most high-end identification system algorithm and the latest hardware to improve the overall resolution. From wafer loading, position alignment/calibration, cutting, cleaning/spin-drying, to film output, all continuous processes The procedures are all fully automated by the machine, which greatly improves the efficiency of production capacity.